Intel 22nm low-power FinFET (22FFL) process technology for 5G and beyond

HJ Lee, S Callender, S Rami, W Shin… - 2020 IEEE Custom …, 2020 - ieeexplore.ieee.org
Intel's 22FFL is the comprehensive FinFET technology offering the best-in-class RF
transistors achieving ft and fmax above 300GHz and 450GHz, respectively. The addition of a …

Implementation of high power RF devices with hybrid workfunction and OxideThickness in 22nm low-power FinFET technology

HJ Lee, S Morarka, S Rami, Q Yu… - 2019 IEEE …, 2019 - ieeexplore.ieee.org
Unique High-Power FinFET device with multiple workfunction materials and oxide thickness
under a common gate, dubbed as HyPowerFF, is introduced. The proposed devices are as …

High linearity U-band power amplifier design: a novel intermodulation point analysis method

J Cui, P Li, W Sheng - Frontiers of Information Technology & Electronic …, 2023 - Springer
A power amplifier's linearity determines the emission signal's quality and the efficiency of the
system. Nonlinear distortion can result in system bit error, out-of-band radiation, and …

Analysis and development of submillimeter-wave stacked-FET power amplifier MMICs in 35-nm mHEMT technology

AB Amado-Rey, Y Campos-Roca… - IEEE Transactions …, 2018 - ieeexplore.ieee.org
This paper reports on the first stacked field-effect transistor (stacked-FET) submillimeter-
wave monolithic integrated circuit (S-MMIC) power amplifier cell operating at 0.3 THz and …

Analysis and design of capacitive voltage distribution stacked MOS millimeter-wave power amplifiers

MH Montaseri, JP Aikio, T Rahkonen… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
Stacked MOS power amplifiers (PA) are commonly used in SOI nodes but also have the
potential to be realized in bulk CMOS nodes. In this paper they are analyzed in millimeter …

Optimum number of transistors in stacked CMOS millimeter-wave power amplifiers

MH Montaseri, J Aikio, T Rahkonen… - … Symposium on Circuits …, 2018 - ieeexplore.ieee.org
This paper proposes how to define the optimum number of stacked transistors in a multi-
stacked CMOS power amplifier (PA) topology, based on several physical as well as circuit …

Lumped-element Wilkinson power combiners using reactively compensated star/delta coupled coils in 28-nm bulk CMOS

M Love, M Thian, F van der Wilt… - IEEE Transactions …, 2019 - ieeexplore.ieee.org
This paper presents four compact lumped-element Wilkinson power combiners (WPC)
operating at 5 GHz in 28-nm bulk CMOS. To minimize the chip area, the inductances in the …

CMOS-compatible MESFETs for high power RF integrated circuits

P Mehr, S Moallemi, X Zhang… - IEEE Transactions …, 2018 - ieeexplore.ieee.org
Metal semiconductor field effect transistors (MESFETs) have been fabricated using a 45-nm
silicon-on-insulator CMOS technology available from Global Foundries. MESFETs with gate …

高线性度U 波段功率放大器设计: 新型交调点分析方法

J CUI, P LI, W SHENG, AJ CUI, AP LI, AW SHENG - Frontiers, 2023 - jzus.zju.edu.cn
功率放大器的线性度决定了通信系统的信号发射质量与系统的发射效率. 非线性失真会导致系统
误码, 带外辐射以及临近信道干扰, 严重影响着通信系统的质量和可靠性. 论文从毫米波功率 …

Design of stacked-MOS transistor mm-wave class C amplifiers for Doherty power amplifiers

MH Montaseri, J Aikio, T Rahkonen… - 2018 IEEE Nordic …, 2018 - ieeexplore.ieee.org
This paper discusses the design requirements of class C auxiliary (aux) amplifiers deployed
in Doherty power amplifiers (DPA). Taking conduction angle and back-off (BO) level into …