HJ Lee, S Morarka, S Rami, Q Yu… - 2019 IEEE …, 2019 - ieeexplore.ieee.org
Unique High-Power FinFET device with multiple workfunction materials and oxide thickness under a common gate, dubbed as HyPowerFF, is introduced. The proposed devices are as …
J Cui, P Li, W Sheng - Frontiers of Information Technology & Electronic …, 2023 - Springer
A power amplifier's linearity determines the emission signal's quality and the efficiency of the system. Nonlinear distortion can result in system bit error, out-of-band radiation, and …
AB Amado-Rey, Y Campos-Roca… - IEEE Transactions …, 2018 - ieeexplore.ieee.org
This paper reports on the first stacked field-effect transistor (stacked-FET) submillimeter- wave monolithic integrated circuit (S-MMIC) power amplifier cell operating at 0.3 THz and …
MH Montaseri, JP Aikio, T Rahkonen… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
Stacked MOS power amplifiers (PA) are commonly used in SOI nodes but also have the potential to be realized in bulk CMOS nodes. In this paper they are analyzed in millimeter …
MH Montaseri, J Aikio, T Rahkonen… - … Symposium on Circuits …, 2018 - ieeexplore.ieee.org
This paper proposes how to define the optimum number of stacked transistors in a multi- stacked CMOS power amplifier (PA) topology, based on several physical as well as circuit …
M Love, M Thian, F van der Wilt… - IEEE Transactions …, 2019 - ieeexplore.ieee.org
This paper presents four compact lumped-element Wilkinson power combiners (WPC) operating at 5 GHz in 28-nm bulk CMOS. To minimize the chip area, the inductances in the …
Metal semiconductor field effect transistors (MESFETs) have been fabricated using a 45-nm silicon-on-insulator CMOS technology available from Global Foundries. MESFETs with gate …
This paper discusses the design requirements of class C auxiliary (aux) amplifiers deployed in Doherty power amplifiers (DPA). Taking conduction angle and back-off (BO) level into …