With technological progress, the request for high power LEDs (HP-LEDs) as a replacement
candidate for common lamp is increased. Due to dissipation of 70–85% of LED input power …

The status and prospects for high-power, phosphor-based white light-emitting diode (LED)
packaging have been presented. A system view for packaging design is proposed to …

In this study, the heat dissipation efficiencies of high power multi-chip COB (Chip-on-Board)
LEDs with five different chip gaps were compared by assessing their junction temperature …

Self-assembly, or the spontaneous organization of parts into larger structures via energy
minimization, is an attractive solution to overcome packaging and integration challenges …

The color uniformity is a critical index in the evaluation of high quality white light emitting
diodes (LEDs). The main factor affecting the color distribution is the state of the phosphor …

A novel wafer level packaging process for phosphor converted LED is presented in this
paper. The core of this process is the fabrication of a silicon substrate with cavities for …

A GA-based train dispatching method is presented. A model for train dispatching on lines
with double tracks is established first, the model can optimize train dispatching by adjusting …

This paper proposes an encapsulation shaping method for white light-emitting diode
packaging, using a silicon substrate with an island structure and using a simple yttrium …

This paper demonstrates a LED wafer level packaging process which employs the glob-top
dispensing technique for encapsulation. The process utilizes the constraint effect introduced …

Phosphor converted LEDs (pc-LEDs), which employ blue LEDs with yellow phosphor
deposition to generate white light illumination is a widely used solid-state lighting source …