Fracture strength of micro-and nano-scale silicon components
Silicon (Si) microfabrication techniques, derived from the microelectronics industry, have
enabled the development and commercialization of microelectromechanical systems …
enabled the development and commercialization of microelectromechanical systems …
In-situ elastic strain mapping during micromechanical testing using EBSD
MJ McLean, WA Osborn - Ultramicroscopy, 2018 - Elsevier
Compared to more commonly used strain measurement techniques, electron backscatter
diffraction (EBSD) offers improved spatial resolution and measurement sensitivity …
diffraction (EBSD) offers improved spatial resolution and measurement sensitivity …
Stress mapping of micromachined polycrystalline silicon devices via confocal Raman microscopy
Stress mapping of micromachined polycrystalline silicon devices with components in various
levels of uniaxial tension was performed. Confocal Raman microscopy was used to form two …
levels of uniaxial tension was performed. Confocal Raman microscopy was used to form two …
[HTML][HTML] High-throughput bend-strengths of ultra-small polysilicon MEMS components
RF Cook, BL Boyce, LH Friedman… - Applied Physics Letters, 2021 - pubs.aip.org
The strength distribution of polysilicon bend specimens, approximately 10 μm in size, is
measured using a high-throughput microelectromechanical system fabrication and testing …
measured using a high-throughput microelectromechanical system fabrication and testing …
[PDF][PDF] APPLIED PHYSICS REVIEWS
FW DelRio, RF Cook, BL Boyce - J. Appl. Phys, 2013 - tsapps.nist.gov
Silicon (Si) microfabrication techniques, derived from the microelectronics industry, have
enabled the development and commercialization of microelectromechanical systems …
enabled the development and commercialization of microelectromechanical systems …