MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies
MEMS inductors are used in a wide range of applications in micro-and nanotechnology,
including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies …
including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies …
A review on enabling technologies for high power density power electronic applications
Abstract Power Electronic Systems for various applications have gone through several
stages of development during last five decades. Its development especially in high power …
stages of development during last five decades. Its development especially in high power …
Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications
Z Wang - Microelectronic Engineering, 2019 - Elsevier
As a powerful enabling technology, three-dimensional (3D) integration, which uses wafer
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …
bonding to integrate multiple wafers in the vertical direction and uses through‑silicon-vias …
Integrated MEMS toroidal transformer with Ni-Zn ferrite core for power supply on chip
H Li, K Zhu, K Lei, T Xu, H Wu - IEEE Transactions on Power …, 2022 - ieeexplore.ieee.org
A miniature integrable transformer is an obstacle to the miniaturization of packaged power
supply on chip (PwrSoC). This letter introduces a through-silicon via (TSV) high-aspect-ratio …
supply on chip (PwrSoC). This letter introduces a through-silicon via (TSV) high-aspect-ratio …
MEMS micro-coils for magnetic neurostimulation
Micro-coil magnetic stimulation of brain tissue presents new challenges for MEMS micro-coil
probe fabrication. The main challenges are threefold;(i) low coil resistance for high power …
probe fabrication. The main challenges are threefold;(i) low coil resistance for high power …
Effects and modulation mechanism of crystal structure on residual stress of Cu films used for metallization
W Li, S Xiao, X Zhang, X Meng, Y Gao, S Fan, T Li… - Thin Solid Films, 2024 - Elsevier
Deformation cracking and delamination arising from residual stress are the main challenges
for metallization in large-scale integrated circuits. Herein, an ultra-low residual stress Cu film …
for metallization in large-scale integrated circuits. Herein, an ultra-low residual stress Cu film …
Nanofabricated high turn-density spiral coils for on-chip electromagneto-optical conversion
Circuit-integrated electromagnets are fundamental building blocks for on-chip signal
transduction, modulation, and tunability, with specific applications in environmental and …
transduction, modulation, and tunability, with specific applications in environmental and …
An ultra-deep TSV technique enabled by the dual catalysis-based electroless plating of combined barrier and seed layers
Silicon interposers embedded with ultra-deep through-silicon vias (TSVs) are in great
demand for the heterogeneous integration and packaging of opto-electronic chiplets and …
demand for the heterogeneous integration and packaging of opto-electronic chiplets and …
Photolithography of SU-8 microtowers for a 100-turn, 3-D toroidal microinductor
JJK Kim, H Al Thuwaini, M Almuslem - Micro and Nano Systems Letters, 2018 - Springer
We present a photolithography scheme for ultra-tall, high-aspect-ratio microstructures. While
increased height of microstructures can expand the design capability of various …
increased height of microstructures can expand the design capability of various …
Analytical expressions for inductances of 3-D air-core inductors for integrated power supply
This work presents analytical expressions for the dc inductance of 3-D air-core inductors
with circular cross-sectional pillars (CCSPs) and rectangular cross-sectional pillars …
with circular cross-sectional pillars (CCSPs) and rectangular cross-sectional pillars …