In the automotive industry, the design and implementation of power converters and
especially inverters, are at a turning point. Silicon (Si) IGBTs are at present the most widely …

Low-temperature copper (Cu) sinter-joining technology has attracted increasing attention in
high-power electronic device packaging because of its low material cost, good electrical and …

A bonding approach based on laser surface modification was developed to address the
poor bonding between Si 3 N 4 ceramic and Cu. The bonding mechanism in Si 3 N 4/Cu …

Silver sintering is a promising die attach technology to ensure high thermal reliability. The
long-term reliability of SiC device sintered by nano-Ag paste has been evaluated by the high …

Robust bonding of Cu quasi-nanoparticles sintering for Ag coated chip and bare copper
substrate was achieved. The effect of temperature, pressure and time on the sintering …

This study focuses on the realization of rapid Ag sintering in 10 minutes under various
temperature conditions without pressure in the air. In each temperature range from 175° C to …

The high-temperature reliability of nano-Ag pastes on bare Cu substrates is of great
significance in power electronics. Although Cu metallization in sintered joints is susceptible …

Ag nanopaste is one of the most promising die-attach materials in power devices. In this
work, robust sintered SiC devices are achieved by using graphene reinforced Ag nanopaste …

Robust bonding and thermal-stable sinter Ag joining on an Au finished substrate was first
time achieved for use in SiC power modules. Five kinds of Ag paste, including different …

Die attachment by pressureless silver sintering at<; 200° C is significant for power electronic
packaging because it can relieve residual thermo-mechanical stress and avoid chip …