Conspectus Electronics manufacturing involves Cu electrodeposition to form 3D circuitry of
arbitrary complexity. This ranges from nanometer-wide interconnects between individual …

Reversible electrodeposition of metals at liquid‐solid interfaces is a requirement for long
cycle life in rechargeable batteries that utilize metals as anodes. The process has been …

Excellent teaching and resource material... it is concise, coherently structured, and easy to
read... highly recommended for students, engineers, and researchers in all related fields." …

Aqueous zinc‐ion batteries (ZIBs) are promising candidates for the next‐generation high‐
energy storage devices, owing to their resource availability, low cost, eco‐friendliness, and …

A variety of copper foams with highly open porous walls have been successfully sculptured
using the gas evolved in an electrochemical deposition process. The pore sizes and wall …

Copper plating baths used for forming integrated circuit interconnects typically contain three
or four component additive mixtures which facilitate the superfilling of via holes and trench …

Superconformal electrodeposition of copper is explained by the recently developed
curvature-enhanced-accelerator coverage (CEAC) model, which is based on the …

Achieving void-defect copper filling by electrodeposition on microvias is essentially
important. Rhodamine B (RhB) is of excellent suppressing ability based on electrochemical …

The kinetics of copper electrodeposition from an acidified cupric sulfate electrolyte
containing SPS-PEG-Cl were examined. Voltammetric and chronoamperometric …

A model of superconformal electrodeposition is presented based on a local growth velocity
that is proportional to coverage of a catalytic species at the metal/electrolyte interface. The …