Issues related to substrate noise in system-on-chip design are described including the
physical phenomena responsible for its creation, coupling transmission mechanisms and …

In the design of high-speed IC's, the influence of the substrate on circuit performance must
be considered carefully. Therefore, in this paper the contribution of the p/sup-/substrate and …

Parasitic substrate coupling can severely degrade the performance of high-speed ICs and
must be considered carefully in circuit design. Therefore, this paper proposes several …

This paper describes theoretical and experimental data characterizing the sensitivity of
nMOS and CMOS digital circuits to substrate coupling in mixed-signal, smart-power systems …

Noise caused by the activity of integrated circuits is a limiting factor for the development of
future VLSI circuits. Transients of voltages and currents couple perturbations to the co …

A way to characterize the crosstalk noise susceptibility for integrated circuits fabrication
technologies is presented. A comparison between 0.7-and 0.35-/spl mu/m technologies …

The placement of substrate contacts in epi and non-epi technologies is analyzed in order to
control and reduce the substrate noise amplitude and spreading. The choice of small or …

A new testing alternative based on thermal wave propagation is proposed. Some failures,
when activated, produce an increase in local power dissipation at various points. A thermal …

The potential for highly integrated radio frequency (RF) and mixed-signal (AMS) designs is
today very real with the availability cost-effective scaled silicon-germanium (SiGe) process …

Theoretical, simulation and experimental analysis and data are presented, discussing
physical design techniques which influence the noise behavior of digital circuits in a mixed …