As to promote the performance of the solder joints applied to electronics industry, the
researchers take advantage of micro/nano-sized particles or another element coated on …

During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

The development of hybrid solder for chip packing is a major 3D packaging research topic.
The incorporation of with low melting points into solder materials has been used in low …

The development of high density and high integration of electronic chips puts forward stricter
requirements on electronic packaging structures. Under the premise of lead-free rules, Sn …

Microstructure of the eutectic region and β-Sn grain of the solder matrix play an important
role in the properties of the Sn-based solder joint. In the present study, Ni and Co …

Microelectronic devices have demonstrated advanced capabilities, including
multifunctionality and high input-output density, rendering them widely used in significant …

Due to the increasing trend of wearable devices and micro-electromechanical systems,
thinner and smaller devices are rapidly increasing in the electronic market. These devices …

The nanomechanical characterisation of unidirectional carbon fibre (CF) reinforced
polyether ether ketone (PEEK) composites using a robotic processing technology known as …

The development of new Pb-free Sn-based solder alloys in the packaging industry
increasingly focuses on corrosion resistance enhancing. In this work, the positive effect by …

Inconel nickel (IN718) superalloy is a cutting-edge material for high temperature
applications owing to its superior mechanical properties in both cryogenic and high …