Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition
Purpose The purpose of this paper is to investigate the effect of carbon nanotube (CNT)
addition on microstructure, interfacial intermetallic compound (IMC) layer and …
addition on microstructure, interfacial intermetallic compound (IMC) layer and …
[PDF][PDF] Kesan rawatan termomekanik dengan mampatan tunggal terhadap mikrostruktur dan sifat mikromekanik aloi pateri Sn-0.7 Cu
Aloi pateri bebas plumbum telah digunakan secara meluas sebagai bahan antara
sambungan bagi peranti elektronik yang memberikan sambungan elektrik bagi …
sambungan bagi peranti elektronik yang memberikan sambungan elektrik bagi …
Temperature-induced thickness reduction of micromechanical properties of Sn-0.7 Cu solder alloy
Solders are used in electronic packaging for metallurgical interconnections.
Thermomechanical methods are used to modify the properties of a material. Cubic Sn-0.7 …
Thermomechanical methods are used to modify the properties of a material. Cubic Sn-0.7 …
[PDF][PDF] REDUCED MODULUS-LOCALIZED HARDNESS RELATIONSHIP OF THERMOMECHANICAL TREATED SN-0.7 CU SOLDER ALLOY VIA …
Solder is widely used as interconnection material in electronic packaging. The properties of
the solder material are important in determining the quality of the solder joint. To some …
the solder material are important in determining the quality of the solder joint. To some …
[PDF][PDF] RADIATION-INDUCED ALTERATIONS IN THE EUTECTIC MICROSTRUCTURE AND HARDNESS OF LEAD-FREE SOLDER
MNH Rosman, WYW Yusoff, NA Abdul - myjms.mohe.gov.my
In this study, the effect of high-dose gamma radiation on the hardness and the eutectic
phase area of SAC305 solder was characterized. The solder paste was applied to the …
phase area of SAC305 solder was characterized. The solder paste was applied to the …