Along with the growing of population and social and technological improvements, the use of
energy and natural resources has risen over the past few decades. The sustainability of …

The reliability of MEMS in shock environments is a complex area which involves structural
dynamics, fracture mechanics, and system reliability theory etc. With growth in the use of …

Commercial off-the-shelf components are increasingly being used in defense and
aerospace applications. Harsh environment applications expose the electronic components …

Electronic components used in defense and aerospace applications may be exposed to
extreme thermo-mechanical shock loading and high-g shock forces. Reinforcing surface …

Fine pitch electronic components in the defense and aerospace applications, experience
high thermo-mechanical loads. To study and understand these scenarios, the printed circuit …

In recent years, penetrating weapons have been used more and more to attack increasingly
hard targets; therefore, the impact of such a penetrating process has increased to an …

Surface mount electronic components reinforced with underfills and epoxy-potting
compounds have shown increase in the survivability expectations under extreme …

Defense and Aerospace applications increasingly rely on commercial off-the shelf
electronics. Electronics in defense applications may be exposed to harsh environments …

Potting electronic components is one of the most effective methods of protecting electronics
assembly in challenging harsh environments. Potting is the process of filling a complete …

High-g shock is a critical challenge for MEMS. The acceleration that eventually acts on the
microstructure of MEMS is usually different from the original shock in terms of amplitude and …