Since the high cost of Ag, current research on traditional high-Ag solders has gradually
shifted to low-Ag solders. However, the microstructure tends to be coarser, and the all …

One of the crucial factors in determining the reliability of an electronic device is fatigue
failure of the interconnecting solder joints. In most cases, large bulk samples are used to …

In order to improve the thermal fatigue reliability of LCCC (Leadless Ceramic Chip Carrier)
solder joints, the assembly process and failure mechanism of LCCC devices are analyzed. It …

The proven ability of solder to joining electronic components in printed circuit boards with
usable metallurgical, mechanical, and conductive properties has led to its widespread use in …

In this study, creep testing methods for three solder specimens with a diameter of 3 mm were
investigated. The creep rupture lifetime of the 3 mm diameter Sn-3.0 Ag-0.5 Cu specimen …

The variation of the maximum tensile stress in each cycle with cycle number during the initial
stage of low-cycle fatigue test before crack initiation was investigated based on the …

This study performs fatigue tests by using a small specimen of Sn3. 0Ag0. 5Cu solder at 313
and 353 K. The specimen has a 3 mm-diameter gage section and a gage length and total …

The effect of element addition on creep and fatigue properties of Sn1. 0Ag0. 7Cu solder with
addition of nickel, germanium and bismuth are reviewed. Element additions imporove creep …

Low-cycle fatigue tests using small specimens of Sn-58Bi solder have been performed at
313 K and 353 K. The samples had a gage diameter and gage length of 3 mm and 6 mm …