(57) ABSTRACT A photonic integrated circuit (PIC) fan-out package and related methods of
forming same are disclosed. The PIC fan-out package includes: an overmold body; a PIC die …

A system includes a housing and a first circuit board positioned inside the housing. The
housing has a top panel, a bottom panel, a left side panel, a right side panel, a front panel …

Memory devices having electro-optical substrates are described herein. In one embodiment,
a memory device includes a plurality of memories carried by an electro optical substrate …

A system includes a housing including a front panel, a rear panel, an upper panel, and a
lower panel. The system includes a first circuit board or substrate, at least one data …

An optoelectronic module. In some embodiments, the module includes: a housing, a
substantially planar subcarrier, a photonic integrated circuit, and an analog electronic …

(57) ABSTRACT A system and method for packing optical and electronic components. A
module includes an electronic integrated circuit and a plurality of photonic integrated …

An apparatus includes a housing capable of being mounted in a rack, and a vertically
oriented switch card. The vertically oriented switch card includes one or more vertically …

A system includes a housing having a front panel, a substrate that is positioned at a distance
from the front panel, and a data processor mounted on the substrate. The system includes a …

A system includes a housing that has a front panel; a substrate that is positioned at a
distance from the front panel, in which a data processor is mounted on the substrate; and a …

Memory devices having optical I/O interfaces are described herein. In one embodiment, a
memory device includes a plurality of memories coupled to a substrate, each memory …