A novel integration of stereolithography and inkjet printing for multichip modules with high frequency packaging applications
R Bahr, B Teharani, M Tentzeris… - 2018 IEEE 68th …, 2018 - ieeexplore.ieee.org
Within this paper methods of additive manufacturing for 3D circuitry is discussed. With
increasing interest in the additive manufacturing of 3D circuits, varying topologies must be …
increasing interest in the additive manufacturing of 3D circuits, varying topologies must be …
Direct Write Electronics–Thick Films on LTCC
T Eastman, A Cook - International Symposium on …, 2014 - meridian.allenpress.com
For low volume, high value microelectronic applications reducing cost and time to initial
production parts in Low Temperature Cofired Ceramics (LTCC) play a big part in customer …
production parts in Low Temperature Cofired Ceramics (LTCC) play a big part in customer …
[PDF][PDF] Additive Manufacturing of Low-temperature Co-fired Ceramics for Microwave Applications
M BENGE - 2016 - core.ac.uk
Additive manufacturing (AM) technologies enable fabrication of structures directly from CAD
files. Due to these technologies adding material one layer at a time, complex, 3D structures …
files. Due to these technologies adding material one layer at a time, complex, 3D structures …