Solder Fatigue Analyses and Predictions for PCB Mounted Components after Thirteen Years of Thermal Field Cycling
R Dudek, R Döring, K Kreyßig, S Rzepka… - … and Multi-Physics …, 2024 - ieeexplore.ieee.org
A long-term temperature cycle test has been running for more than 13 years to answer the
most challenging questions about dominating failure modes and degradation processes …
most challenging questions about dominating failure modes and degradation processes …
A continuum damage mechanics approach for the reliability of lead-free solders subjected to cyclic loading
Cyclic loading of solder joints in electronic assemblies often leads to damage accumulation
and fatigue failure. One cause of such loading is exposure to cyclic temperatures when …
and fatigue failure. One cause of such loading is exposure to cyclic temperatures when …
Analytical and experimental studies on the damage evolution of SAC solder alloys
A set of fatigue experiments is carried out, currently at room temperature, with different
duration of cycling and, consequently, different levels of damage in the specimens. Various …
duration of cycling and, consequently, different levels of damage in the specimens. Various …