Materials merging mechanism of microfluidic electroless interconnection process
A low-temperature, pressureless bonding process, referred to as the microfluidic electroless
interconnection process, has been developed for chip-stacking applications, in which …
interconnection process, has been developed for chip-stacking applications, in which …
Optimal design of thermo-compression bonder via ANN-based surrogate modeling under uncertainty
The miniaturisation of electronic devices demands advanced microelectronics packaging
systems dominated by interconnection reliability. Thermo-compression bonding (TCB) is a …
systems dominated by interconnection reliability. Thermo-compression bonding (TCB) is a …
Microstructure evolution and growth behavior of Cu/SAC105/Cu joints soldered by thermo-compression bonding
M Guo, F Sun, Z Yin - Soldering & Surface Mount Technology, 2019 - emerald.com
Purpose This paper used a novel technique, which is thermo-compression bonding, and Sn-
1.0 Ag-0.5 Cu solder to form a full intermetallic compound (IMC) Cu3Sn joints (Cu/Cu3Sn/Cu …
1.0 Ag-0.5 Cu solder to form a full intermetallic compound (IMC) Cu3Sn joints (Cu/Cu3Sn/Cu …
A Review of Die-to-Die, Die-to-Substrate and Die-to-Wafer Heterogeneous Integration
This paper reviews advances in die/dielet-to-dielet (D2D), dielet-to-wafer (D2W) and dielet-
to-substrate integration for advanced packaging. Key D2D and D2W integration approaches …
to-substrate integration for advanced packaging. Key D2D and D2W integration approaches …
Integrated RTD sensors for maintaining thermal uniformity during TCB process
SB Jemaa, J Sylvestre, P Gagnon - 2019 IEEE 69th Electronic …, 2019 - ieeexplore.ieee.org
Thermocompression bonding (TCB) is an advantageous method adapted for system
miniaturization, for instance to assemble microelectronic devices in 3D stacks. Low …
miniaturization, for instance to assemble microelectronic devices in 3D stacks. Low …
A study on the brittle characteristics of fused silica header driven by piezoelectric actuator for laser assisted TC bonding
DW Lee, SJ Ha, JY Park, GS Yoon - Journal of the Korea Society of …, 2019 - koreascience.kr
Semiconductor chip is bonded to the substrate by melting solder bumps. In general, the chip
bonding is applied by a Reflow process or a Thermo-Compression (TC) bonding process. In …
bonding is applied by a Reflow process or a Thermo-Compression (TC) bonding process. In …
Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling
D Athia - 2017 - uwspace.uwaterloo.ca
Thermo-compression bonding (TCB) relies on uniform thermal distribution during
microelectronic packaging processes to ensure reliable interconnects are formed. During …
microelectronic packaging processes to ensure reliable interconnects are formed. During …
[PDF][PDF] Développement de procédés avancés d'encapsulation de composants microélectroniques basés sur les techniques de thermocompression
SB Jemaa - 2020 - savoirs.usherbrooke.ca
RÉSUMÉ L'un des grands défis de la recherche et développement est d'optimiser
l'ensemble du cycle de fabrication d'un produit microélectronique, depuis sa conception …
l'ensemble du cycle de fabrication d'un produit microélectronique, depuis sa conception …
Design of flexure hinge to reduce lateral force of laser assisted thermo-compression bonding system
DW Lee, SJ Ha, JY Park, GS Yoon - Design & Manufacturing, 2020 - koreascience.kr
Abstract Laser Assisted Thermo-Compression Bonding (LATCB) has been proposed to
improve the" chip tilt due to the difference in solder bump height" that occurs during the …
improve the" chip tilt due to the difference in solder bump height" that occurs during the …