[HTML][HTML] AgIn2 thickness on void rate, microstructure, IMC growth, thermal and mechanical properties of fluxless In@ AgIn2 joint
J Wen, G Sun, J Su, Y Fan, L Fu, Z Chen… - Journal of Materials …, 2025 - Elsevier
Indium (In) has been extensively used as a thermal interface material (TIM1) between the
die and lid in high-power central processing units (CPUs) to enhance heat dissipation …
die and lid in high-power central processing units (CPUs) to enhance heat dissipation …