Development of hybrid optical sensor based on deep learning to detect and classify the micro-size defects in printed circuit board

GU Kaya - Measurement, 2023 - Elsevier
Testing with naked eye contact on large-sized printed circuit boards (PCBs) mass produced
is exhausting and time consuming. Since the eyes will get tired during the long-term test …

Experimental determination of strain distribution on Printed Circuit Boards using Digital image correlation

A Falk, L Marsavina, O Pop - Procedia Structural Integrity, 2019 - Elsevier
The paper investigates the use of digital image correlation (DIC) for strain measurement on
Printed Board Circuits (PCBs). Digital Image Correlation (DIC) is a full-field contactless …

Board-level shear, bend, drop and thermal cycling reliability of lead-free chip scale packages with partial underfill: a low-cost alternative to full underfill

H Shi, C Tian, M Pecht, T Ueda - 2012 IEEE 14th Electronics …, 2012 - ieeexplore.ieee.org
Full capillary flow underfill (FCFU) has been proven to be effective in improving the board-
level mechanical reliability of lead-free (LF) area array packages (AAPs). However, the …

Effect of sampling rate on the accuracy of strain gage measurement during printed circuit board functional test

H Shi, C Tian, R Zhang, D Yu… - 2012 13th International …, 2012 - ieeexplore.ieee.org
Strain gage measurement is widely used in electronic industry as an effective tool for
assessing and controlling risk levels. However, the accuracy of strain gage measurement is …

Reducing the failure risk of portable electronic devices under field use conditions through triaxial strain gage array technology

H Shi, C Tian, S Ikezawa, T Ueda - SENSORS, 2012 IEEE, 2012 - ieeexplore.ieee.org
Increasing functional density of portable electronic devices has led to the explosive growth
in the array-based package (ABP) usage, however, the decreasing I/O pitch of ABPs and the …