Semiconductor Industries are mainly facing problems by using planar integration (2D IC) in
order to overcome the paradigm shift has been adopted as vertical IC integration so called …

Over the period of meticulous scaling IC's are crucially waiting for a platform which is planar.
The most important and actual restriction is nothing, but delay of interconnect is almost …

Abstract 3D Integration technology is probably the best methodologies among others which
suits CMOS applications with in various layers of devices are stacked with high thickness …

The size of features has consistently decreased due to technology scaling, but
interconnects, unlike transistors, have not followed this trend. A current solution to the power …

As demand for smaller, quicker, and more powerful devices rises, Moore's law is strictly
followed. The industry has worked hard to make little devices that boost productivity. The …