Diamond wire sawing (DWS) is the primary stage in the semiconductor industry for slicing
hard and brittle materials, delivering high surface quality with minimum kerf losses. Despite …

Considering the random distribution characteristics of diamond abrasive, a new evaluation
model of subsurface damage (SSD) depth is proposed for the solar silicon wafer processed …

Silicon-based solar photovoltaics cells are an important way to utilize solar energy. Diamond
wire slicing technology is the main method for producing solar photovoltaics cell substrates …

In order to optimize the process of wire sawing, this work studied the subsurface crack
damage in silicon wafers induced by resin bonded diamond wire sawing using theoretical …

Reducing the as-cut thickness of silicon wafers is one of the key issues to significantly lower
the manufacturing costs of the photovoltaic industry. The pursuit of this objective is …

The damages of silicon wafer in diamond wire sawing have a significant impact on its
mechanics, economy, and use properties, which should be evaluated accurately and …

Select emerging solar cell technologies, ranging from very narrow screen-printed fingers to
perovskite/silicon tandems, would benefit from a reduction of the height of the standard …

Ultra-thin silicon slicing technology plays a critical role in achieving high-efficiency and low-
cost solar cells in the photovoltaic (PV) industry. However, the surface phase evolution of …

This paper aims on slicing of c-plane mono-crystalline aluminum oxide using reciprocating
electroplated diamond wire in rocking mode sawing process. Effect of process parameters …

The aim of this research is to introduce a fast characterization method for diamond wires and
the resultant silicon workpiece surface quality at high wire cutting speeds. The work is …