Chip packaging engineering has evolved significantly to meet the performance demands of
integrated circuits (IC) and micro-electromechanical systems (MEMS). Layers, mainly …

Delamination is a critical failure mode in power electronics packages that can significantly
impact their reliability and performance, due to the large amounts of electrical power …

Semiconductor advancements demand greater integrated circuit density, structural
miniaturization, and complex material combinations, resulting in stress concentrations from …

Sintered silver nanoparticles (AgNPs) are widely used in high-power electronics due to their
exceptional properties. However, the material reliability is significantly affected by various …

Examining crack propagation at the interface of bimaterial components under various
conditions is essential for improving the reliability of semiconductor designs. However, the …

The presence of reliable techniques for predicting the stress state in composite materials is
one of the most important requirements in the design of composite components and …

The survivability and reliability of commercial electronic components under very high thermo-
mechanical loads are improved using underfilling and potting methods. Potting protects from …

Continuing demands in semiconductor industry demand increase in density of integrated
circuits (ICs) and complex material combinations. Mismatch in material properties like …