Polishing compositions and methods for removing conduc tive materials from a substrate
surface are provided. In one aspect, a composition includes an acid based electrolyte …

(57) ABSTRACT A method of processing a Substrate having a conductive material layer
disposed thereon is provided which includes positioning the Substrate in a process …

5,466.297 A 1 1/1995 Goodman et al. 2005/0284.844 A1 12/2005 Hattori 5,466,389 A 1
1/1995 Ilardi et al. 2006/0016785 A1 1/2006 Egbe et al. 5,489,557 A 2, 1996 Jolley 2006/00 …

An cleaning composition and process for cleaning post chemical mechanical polishing
(CMP) residue and contami nants from a microelectronic device having said residue and …

(54) METHOD AND COMPOSITION FOR 10/032,275, filed on Dec. 21, 2001, now Pat. No.
POLISHINGA SUBSTRATE 6,899,804, application No. 11/196,876, which is a continuation …

Polishing compositions and methods for removing conductive materials from a substrate
surface are provided. In one aspect, a composition includes an acid based electrolyte …

Polishing compositions and methods for removing conduc tive materials and barrier
materials from a substrate surface are provided. Polishing compositions are provided for …

An apparatus and method for planarizing a surface of a Substrate using a chamber
separated into two parts by a membrane, and two separate electrolytes is provided. The …

SUMMARY OF THE INVENTION 0005 The present invention provides compositions for
electro-chemical-mechanical polishing (e-CMP) of chip interconnect materials. These …

Compositions and methods for processing a substrate having a conductive material layer
disposed thereon are provided. In one embodiment, a composition for processing a …