This paper presents the first part of a state of the art review on the No Fault Found (NFF)
phenomenon. The aim has been to compile a systematic reference point for burgeoning NFF …

This is the second half of a two paper series covering aspects of the no fault found (NFF)
phenomenon, which is highly challenging and is becoming even more important due to …

The test path of solder joint intermittent connection faults under direct-current stimulus is
examined in this paper. According to the physical structure of the circuit, a network model is …

Purpose This paper aims to reproduce the electrical connector intermittent fault behaviours
with step-up vibration stress while maintaining the integrity of the product …

Latent defects within semiconductors have been a primary cause of final inspection failures
within the electronic control unit (ECU) manufacturing process. Finding the true root cause …

(1. Equipment Management and Support College, Armed Police Force Engineering
University, Xi 忆an 710086, China; 2. Materiel Management and Safety Engineering …

Aiming at intermittent fault detection problem that caused by solder joint under vibration
stress, induced mechanism of solder joint intermittent fault is analysed and the detection …

This study is about the field failure and mechanism of Chip on Film (COF) based Line Driver
IC (LDI) for FPD. Due to LDI failure, there is vertical line defect on Flat Panel Display (FPD) …

This paper presents an investigation of the insulation resistance/leakage current failure of
low-voltage ZnO varistors in the field. Failed varistors resumed normal operation after …