The 2023 terahertz science and technology roadmap

A Leitenstorfer, AS Moskalenko… - Journal of Physics D …, 2023 - iopscience.iop.org
Terahertz (THz) radiation encompasses a wide spectral range within the electromagnetic
spectrum that extends from microwaves to the far infrared (100 GHz–∼ 30 THz). Within its …

Review of THz-based semiconductor assurance

J True, C Xi, N Jessurun, K Ahi… - Optical …, 2021 - spiedigitallibrary.org
Terahertz radiation for inspection and fault detection has been of interest for the
semiconductor industry since the first generation and detection of THz signals. Until recent …

[图书][B] Metrology and Diagnostic Techniques for Nanoelectronics

Z Ma, DG Seiler - 2017 - taylorfrancis.com
Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …

Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview

JM Chin, V Narang, X Zhao, MY Tay, A Phoa… - Microelectronics …, 2011 - Elsevier
Failure analysis plays a major role in all areas of the semiconductor company especially
during product development cycle, 1st silicon stage, or in wafer processes and fabrication as …

Advanced fault isolation technique using electro-optical terahertz pulse reflectometry

MY Tay, L Cao, M Venkata, L Tran… - 2012 19th IEEE …, 2012 - ieeexplore.ieee.org
Electro-optical terahertz pulse reflectometry (EOTPR) was introduced recently to isolate
faults in advanced IC packages. The EOTPR system provides 10 μm in distance accuracy …

Contact-free fault location and imaging with on-chip terahertz time-domain reflectometry

M Nagel, A Michalski, H Kurz - Optics express, 2011 - opg.optica.org
We demonstrate in a first experimental study the application of novel micro-machined
optoelectronic probes for a time-domain reflectometry-based localization of discontinuities …

Electro optical terahertz pulse reflectometry—A fast and highly accurate non-destructive fault isolation technique for 3D flip chip packages

S Barbeau, J Alton, M Igarashi - International Symposium for …, 2013 - dl.asminternational.org
Abstract Electro Optical Terahertz Pulse Reflectometry (EOTPR), a terahertz based Time
Domain Reflectometry (TDR) technique, has been evaluated on Flip Chip (FC) and 3D …

A deep transfer learning model for packaged integrated circuit failure detection by terahertz imaging

Y Lu, Q Mao, J Liu - IEEE Access, 2021 - ieeexplore.ieee.org
Terahertz time-domain spectroscopy imaging system (THz-TDS) is becoming a promising
tool for packaged integrated circuit (IC) failure detection due to its nonmetal penetrability and …

Laser voltage probing in failure analysis of advanced integrated circuits on SOI

VK Ravikumar, R Wampler, MY Ho… - … for Testing and …, 2012 - dl.asminternational.org
Laser voltage probing is the newest generation of tools that perform timing analysis for
electrical fault isolation in advanced failure analysis facilities. This paper uses failure …

Magnetic field imaging for electrical fault isolation

A Orozco - Microelectronics Failure Analysis: Desk Reference, 2019 - books.google.com
As process technologies of integrated circuits become more complex and the industry keeps
advancing packaging technologies like flip-chip, stacked die, Wafer-Level-packaging …