(54) METHOD AND STRUCTURE FOR 6,033,974 A 3/2000 Henley et al. FABRICATING
MULTIPLETILED REGIONS 6,048,411 A* 4/2000 Henley et al............... 148,335 ONTO A …

(57) ABSTRACT A method for fabricating one or more devices, eg, inte grated circuits. The
method includes providing a substrate (eg, silicon), which has a thickness of semiconductor …

Systems and methods related to an image sensor of one or more embodiments include
Subjecting a donor semiconduc tor wafer to an ion implantation process to create an exfo …

Systems and methods of production of a photovoltaic device include creating on a donor
semiconductor wafer an exfo liation layer and transferring the exfoliation layer to an insulator …

A method for forming a strained silicon layer of semiconductor material. The method
includes providing a deformable surface region having a first predetermined radius of …

6,323,108 B1* 1 1/2001 Kub et al....... 438,458 FOREIGN PATENT DOCUMENTS 6,323,110
B2* 1 1/2001 Ling............. 438,459 6,335.263 B1 1/2002 Cheung et al.. 438/455 WO WO …

(57) ABSTRACT A method for fabricating one or more devices, eg, inte grated circuits. The
method includes providing a multi layered substrate, Which has a thickness of material (eg …

4,585,671 A 4, 1986 Kitagawa et al. 4,696,758 A 9/1987 Ovshinsky et al. 5, 120,394 A 6,
1992 Mukai 5,789,030 A 8, 1998 Rolfson 5,877,070 A 3, 1999 Goesele et al. 6,013,563 A …

(57) ABSTRACT A method for fabricating bonded Substrate structures, eg, silicon on silicon.
In a specific embodiment, the method includes providing a thickness of single crystal silicon …

A multilayered Substrate structure comprising one or more devices, eg, optoelectronic,
integrated circuit. The structure has a handle Substrate, which is characterized by a prede …