Printed electronics (PEs), as a fast-growing advanced manufacturing technology in recent
years, plays an essential role in development of wearable electronic sensors, flexible …

The system-in-package (SiP) has gained much interest in the current rapid development of
integrated circuits (ICs) due to its advantages of integration, shrinking, and high density. This …

We show in this article two fully additively manufactured microwave packages with
integrated active and passive components. Packages were constructed using a chip-first …

This article presents the first time that an millimeter-wave (mm-wave) multichip module
(MCM) with on-demand “smart” encapsulation has been fabricated utilizing additive …

This article focuses on improving the robustness of fully additive manufactured packaging
solutions for application-specific, millimeter-wave (mm-wave) system integration. We …

In this letter, we demonstrate a fully additively manufactured packaged W-band amplifier
with integrated bypass capacitors. This package was fabricated using a chip-first approach …

In this article, we demonstrate the design, fabrication, and characterization of a-band system-
on-package (SoP). This package is fully additively manufactured using a chip-first process …

This article presents the first and most comprehensive design, fabrication, and reliability
evaluation of the electrical and mechanical performance of fully inkjet-printed 3-D “ramp” …

In this article, the first-band laser-enhanced direct print additive manufacturing (LE-DPAM)
monolithic microwave integrated circuit (MMIC) chip-carrier assembly is demonstrated …

In this article, the particular importance of nanotechnology-enabled materials associated
with additive manufacturing techniques for the realization of radio-frequency (RF) …