Ceramic particles reinforced copper matrix composites manufactured by advanced powder metallurgy: Preparation, performance, and mechanisms

YF Yan, SQ Kou, HY Yang, SL Shu, F Qiu… - … Journal of Extreme …, 2023 - iopscience.iop.org
Copper matrix composites doped with ceramic particles are known to effectively enhance
the mechanical properties, thermal expansion behavior and high-temperature stability of …

Processing methods and mechanical properties of aluminium matrix composites

GF Aynalem - Advances in Materials Science and Engineering, 2020 - Wiley Online Library
Processing methods of aluminium matrix composites (AMCs) have been changing
continuously considering the ease of manufacturing and the final quality of the desired …

Thermal conductivity of polymer-based composites with magnetic aligned hexagonal boron nitride platelets

C Yuan, B Duan, L Li, B Xie, M Huang… - ACS applied materials & …, 2015 - ACS Publications
Hexagonal boron nitride (hBN) platelets are widely used as the reinforcing fillers for
enhancing the thermal conductivity of polymer-based composites. Since hBN platelets have …

Manufacturing techniques for metal matrix composites (MMC): an overview

L Singh, B Singh, KK Saxena - Advances in Materials and …, 2020 - Taylor & Francis
In the present short review of manufacturing techniques of metal matrix composites (MMCs),
aluminium and magnesium MMCs are reviewed in terms of their application and properties …

[HTML][HTML] Review of metal matrix composites with high thermal conductivity for thermal management applications

X Qu, L Zhang, WU Mao, S Ren - Progress in Natural Science: Materials …, 2011 - Elsevier
Metal matrix composites with high thermal conductivity and tailorable coefficient of thermal
expansion are found widespread applications in electronic package and thermal …

Device-level thermal management of gallium oxide field-effect transistors

B Chatterjee, K Zeng, CD Nordquist… - IEEE Transactions …, 2019 - ieeexplore.ieee.org
The ultrawide bandgap (UWBG)(~ 4.8 eV) and melt-grown substrate availability of β-Ga 2 O
3 give promise to the development of next-generation power electronic devices with …

[HTML][HTML] High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

C Chen, Y Xue, X Li, Y Wen, J Liu, Z Xue, D Shi… - Composites Part A …, 2019 - Elsevier
In this study, epoxy (EP)/binary spherical alumina (S-Al 2 O 3) composites with a high
loading of 50 vol% were fabricated by incorporating different sizes of S-Al 2 O 3 into EP to …

Thermal management of electronic devices using carbon foam and PCM/nano-composite

WG Alshaer, SA Nada, MA Rady, EP Del Barrio… - International Journal of …, 2015 - Elsevier
A detailed experimental study of a hybrid composite system for thermal management (TM) of
electronics devices was performed. Three different TM modules made of pure carbon foam …

Synergistic enhanced thermal conductivity of epoxy composites with boron nitride nanosheets and microspheres

L Zhao, L Yan, C Wei, Q Li, X Huang… - The Journal of …, 2020 - ACS Publications
Herein, we report a new strategy to effectively enhance the thermal conductivity of epoxy
composites by constructing a three-dimensional thermally conductive network with 2D boron …

[HTML][HTML] High thermal conductivity of flexible polymer composites due to synergistic effect of multilayer graphene flakes and graphene foam

YH Zhao, YF Zhang, SL Bai - Composites Part A: Applied Science and …, 2016 - Elsevier
Research on flexible thermal interface materials (TIMs) has shown that the interconnected
network of graphene foam (GF) offers effective paths of heat transportation. In this work, a …