Interconnect scaling has become a major design challenge for traditional planar (2D)
integrated circuits (ICs). Three-dimensional (3D) IC that stacks multiple device layers …

Abstract Network-on-chips (NoCs) have been widely employed in the design of
multiprocessor system-on-chips (MPSoCs) as a scalable communication solution. NoCs …

In this article, we study the problem of how to maximize the throughput of a periodic real-time
system under a given peak temperature constraint. We assume that different tasks in our …

Hotspots occur frequently in 3D multi-core processors (3D-MCPs) and they can adversely
impact system reliability and lifetime. Moreover, frequent occurrences of hotspots lead to …

Thermal aware scheduling (TAS) is an important system level optimization for many-core
systems. A fast event driven thermal estimation method, which includes both the dynamic …

Abstract Three-dimensional (3D) multicore chips have been recently developed to deal with
the power consumption and interconnection delay problems of embedded systems; …

The substantial silicon density in 3D VLSI, albeit its numerous advantages, introduces
serious thermal threats that would lead to faults and system failures. This article introduces a …

Thermal-constrained task scheduler for throughput optimization on 3-D multicore processors
(3-D MCPs) has been studied extensively. However, these throughput-optimized strategies …

Synergistic processing between multiple instruction set architecture (ISA) cores and heat
flows in a 3D heterogeneous multicore chip exacerbates the complexity of thermal problems …

Heterogeneous integration enabled by 3D technology is one of the innovations for future
microprocessor design. By the heterogeneous integration of memory and multi-core …