Active cycling of power devices, ie exposure to repetitive voltage and current pulses, causes
power dissipation, resulting in thermo-mechanical loads that can cause different failure …

Growing demands on performance and durability of integrated circuits (ICs) require an
understanding of possible failure mechanisms. One main cause for damage of ICs arises …

Reliability stress testing of power semiconductors requires significant development effort for
a test apparatus to provide the required functionality. This paper presents a modular test …

This study aims to assess the reliability of smart converters for applications using 24 V
batteries. It compares degradation effects and lifetime durations for similar dissipated …

Modern power semiconductor devices used in automotive products and industrial systems
have to reliably withstand up to 109 and more high power density electrical pulses. The heat …

Microcontroller modules are introduced to a life test system to apply stimuli and stress
patterns to the unit under test. The firmware must evaluate the status or operational function …

Conventional reliability testing of microelectronic power devices requires dedicated test
systems. In order to test a statistically meaningful set of devices, only simplified stress pattern …

Active cycling of power devices operated in harsh conditions causes high power dissipation,
resulting in critical electrothermal and thermo-mechanical effects that may lead to …

Power MOSFETs integrated in modern Smart Power switches feature a substantial high
current capability due to the very low value of their transconductance coefficient K. In this …

Electronic power devices have to withstand high mechanical stresses which generate during
the operation of high electric powers due to local heating and thermal expansion. The …