Mechanical characterization of doped SAC solder materials at high temperature

MR Chowdhury, S Ahmed, A Fahim… - 2016 15th IEEE …, 2016 - ieeexplore.ieee.org
Reliable lead free solders are needed for products exposed to extreme environments such
as those used in the automotive, avionics, and oil-exploration industries, as well as in …

High temperature creep response of lead free solders

A Fahim, S Ahmed, MR Chowdhury… - 2016 15th IEEE …, 2016 - ieeexplore.ieee.org
Lead free solder materials are susceptible to significant creep deformations in harsh high
temperature environments including automotive, avionics, military, and oil exploration …

Effect of Ni and Sb additions and testing conditions on the mechanical properties and microstructures of lead-free solder joints

QB Tao, L Benabou, L Vivet, VN Le… - Materials Science and …, 2016 - Elsevier
Nowadays, one of the strategies to improve the reliability of lead-free solder joints is to add
minor alloying elements to solders. Therefore, the aims of this study are to investigate the …

Viscoplastic characterization and post-rupture microanalysis of a novel lead-free solder with small additions of Bi, Sb and Ni

QB Tao, L Benabou, VN Le, H Hwang… - Journal of Alloys and …, 2017 - Elsevier
Due to the RoHS and WEEE legislations for restricting the use of six hazardous materials in
the manufacture of various types of electronic and electrical equipment, developing novel Pb …

Mechanical performance of advanced multicomponent lead-free solder alloy under thermal aging

D Zhou, A Haseeb, A Andriyana - Materials Today Communications, 2022 - Elsevier
Reliability of lead-free solders, used in harsh conditions such as in automotive, is still a
serious concern. Simultaneous additions of multiple alloying elements like Bismuth (Bi) …

Isothermal aging and shear creep behavior of a novel lead-free solder joint with small additions of Bi, Sb and Ni

QB Tao, L Benabou, TAN Van… - Journal of Alloys and …, 2019 - Elsevier
In this paper, we investigate the effects of isothermal aging on the microstructure and creep
properties of a novel lead-free SAC387-3Bi-1.5 Sb-0.15 Ni (InnoLot)/Cu solder joints. Single …

High temperature mechanical behavior of SAC and SAC+ X lead free solders

MS Alam, KMR Hassan, JC Suhling… - 2018 IEEE 68th …, 2018 - ieeexplore.ieee.org
In this work, we have investigated the mechanical behavior of several SAC and SAC+ X lead
free solder alloys at extreme high temperatures up to 200 oC. The studied alloys included …

High temperature tensile and creep behavior of lead free solders

MS Alam, JC Suhling, P Lall - 2017 16th IEEE Intersociety …, 2017 - ieeexplore.ieee.org
The mechanical behavior of lead free solders is highly dependent on the testing
temperature. Previous investigations on mechanical characterization of conventional and …

A design of a new miniature device for solder joints' mechanical properties evaluation

QB Tao, L Benabou, L Vivet, KL Tan… - Proceedings of the …, 2017 - journals.sagepub.com
This paper makes a focus on the design of a micro-testing machine used for evaluating the
mechanical properties of solder alloys. The different parts of the testing device have been …

Corrosion reliability of lead-free solder systems used in electronics

F Li, V Verdingovas, K Dirscherl… - 2018 IMAPS Nordic …, 2018 - ieeexplore.ieee.org
The present work investigated the corrosion reliability of five Sn-Ag-Cu (SAC) based lead-
free solder alloys. The first focus was placed on microstructural analysis of the intermetallic …