Prognostics and health management (PHM) is an enabling discipline consisting of
technologies and methods to assess the reliability of a product in its actual life cycle …

Nanoelectronics is changing the way the world communicates, and is transforming our daily
lives. Continuing Moore's law and miniaturization of low-power semiconductor chips with …

Failure Analysis (FA) is indispensable for any reliability analysis, being used, among other
things, for epoxy/rubber blend materials and for the encapsulated electronic components …

In the past few decades, Flip chip (FC) has been one of the mainstream technologies in IC
packaging. But the size and spacing of the solder bumps are decreasing gradually, defect …

Quantitative detection of thermal barrier coating thickness based on simulated annealing
(SA) algorithm has been carried out using pulsed infrared thermography technology. The …

With the development of electronics towards smaller, more compact, and increasingly
complex, flip chip technology has been used extensively in microelectronic packaging, and …

热障涂层(TBC) 是航空航天发动机涡轮叶片的主要防护材料, 对其进行表面裂纹缺陷和界面脱粘
缺陷的无损检测具有重大意义. 对热障涂层的传统检测方法(如渗透检测, 涡流检测 …

Solder bump technology has been used extensively in microelectronic packaging. But defect
inspection becomes increasingly difficult due to the decrease of solder bumps in dimension …

With the decrease of solder bumps in dimension and pitch, defects inspection of the solder
bumps become more difficult. A nondestructive detection system based on the active …

No available method can automatically verify the correctness of the wire bonding positions
on a multi-layered wire IC. This paper presents a novel method that integrates image …