This application is a divisional of application Ser. No. 09/517,839, filed on Mar. 2, 2000,
which is a continuation in part of application Ser. Nos. 09/120,172 filed Jul. 21, 1998 now US …

A crystalline substrate based device includes a crystalline substrate having formed thereon
a microstructure, and a transparent packaging layer which is sealed over the microstructure …

(57) ABSTRACT A semiconductor product comprises a semiconductor Sub strate having a
top surface and a bottom surface including a semiconductor chip. The semiconductor …

3,320,658 A 5, 1967 Bolda et al. 6,054,337 A 4/2000 Solberg 3,396,894 A 8, 1968 Ellis
6,060,769 A 5, 2000 Wark 3,472.365. A 10/1969 Tiedema 6,063,646 A 5, 2000 Okuno et al …

The mechanisms of forming a copper post structures described enable formation of copper
post structures on a flat conductive surface. In addition, the copper post structures are …

A method of producing a crystalline substrate based device includes forming a
microstructure on a crystalline substrate. At least one packaging layer is sealed over the …

A flip-chip package technology is proposed for use to fabricate a dual-chip integrated circuit
package that includes two semiconductor chips in a single package unit, which is …

A semiconductor substrate (1) is secured by suction to a rear face (1 b) of a supporting face
(11 a) of a substrate supporting table (11). In this event, the thickness of the semiconductor …

(57) ABSTRACT A method for producing encapsulated chips includes pre paring a wafer
with contacts projecting from a Surface of the wafer. The wafer is disposed on a dicing …

A method for 3D device packaging utilizes through-Sub strate pillars to mechanically and
electrically bond two or more dice. The first die includes a set of access holes extending from …