US11195748B2 - Interconnect structures and methods for forming same - Google Patents
US11195748B2 - Interconnect structures and methods for forming same - Google Patents …

A method for forming a barrier diffusion layer on a substrate includes depositing a tantalum
layer in features of the substrate using an atomic layer deposition process. The method …

A sputtering apparatus including a chamber, a gas supply configured to supply the chamber
with a first gas and a second inert gas, the first inert gas and the second inert gas having a …

There is provided a sputtering apparatus comprising: a target from which sputtered particles
are emitted; a substrate support configured to support a substrate; a substrate moving …

(57) ABSTRACT A sputtering apparatus including a chamber, a gas supply configured to
supply the chamber with a first gas and a second inert gas, the first inert gas and the second …