Renewable energy and electric vehicles are crucial subjects of the global transition towards
a sustainable future. Insulated gate bipolar transistors (IGBTs) are essential components of …

Board-level drop responses are critical to evaluate the mechanical reliability of solder joints
to serve as electrical and mechanical connections in electronic devices to resist failure due …

Purpose This paper aims to present a machine learning framework for using big data
analytics to predict the reliability of solder joints. The purpose of this study is to accurately …

The effect of solder joint fabrication on the thermal properties of IGBTs soldered onto glass-
epoxy substrate (FR4) was investigated. Glass-epoxy substrates with a thickness of 1.50 …

This paper proposes a method to identify damage-sensitive electrical parameters (DESPs)
for insulated gate bipolar transistor (IGBT) bond wires. Multiphysics simulations are …

Featured Application The presented results can be applied in the analysis of properties of
the assembly process of RF networks. Abstract The paper discusses selected statistical …

The demand for miniaturised electronic devices has led to various challenges in
microelectronic industries. One of the challenge is the removal of fans in some applications …

Printed circuit board assembly (PCBA) is a cost-effective hardware device used in
mechanical, process, electrical, electronic, military, and medical equipment providing …

Featured Application It is an important trend that Pb-free materials in electronic
devices/components are used in the aerospace field. Several reliability issues associated …

Purpose This paper presents the results of the investigations of LED modules soldered with
the use of different soldering pastes. Design/methodology/approach The tested power LED …