Silicon-on-insulator (SOI) wafers are crucial raw materials in the manufacturing process of
microelectromechanical systems (MEMS). Residual stresses generated inside the wafers …

This chapter mainly focuses on the introduction of residual stress characterization of MEMS
materials. The origin and classification of residual stress appearing in thin films and MEMS …

MEMS device degradation due to aging and other factors is becoming a major concern
because it will cause parametric deviations and catastrophic failures in the mechanical and …

z 轴硅微机械陀螺仪采用体硅薄片溶解法制作, 在加工过程中引入了残余应力.
从理论上分析了残余应力对z 轴陀螺仪工作模态的影响, 并采用有限元软件进行了仿真 …

Die faseroptische Datenübertragung hat sich als äußerst vielversprechendes Verfahren
erwiesen, um den steigenden Ansprüchen der sich rasant entwickelnden …

La fiabilité de la simulation thermomécanique de composants de puissance est fortement
liée à la précision des paramètres mécaniques tels que le module de Young (E) et le …

為瞭解洗掃作用對周界懸浮微粒之逐時變化及削減效率對空氣品質之改善成效,
本研究配合理論分析實場洗掃作業對周界之懸浮微粒及路面街塵的削減率來進行評估. 此外 …

Micromachined z-axis vibrating rate gyroscopes we design are fabricated by the dissolved
wafer process (DWP). Residual stresses are developed in mechanical parts of gyroscopes …

Micro-Rings have been widely used for measurement of residual tensile stress in thin films.
This measurement approach provides a simple and convenient way to estimate the stress …

This paper describes a novel fabrication method to minimize bending and distortion of
sensor plates by adding a thick (a few microns) nickel-reinforced beam on a thin (≤ one …