In this review paper, the complete discoveries of dielectric materials from ceramics to
polymer composites and concepts that lead to applying these materials in actual …

The development of information transmission technology towards high-frequency
microwaves and highly integrated and multi-functional electronic devices has been the …

Decrease in processing speed due to increased resistance and capacitance delay is a
major obstacle for the down-scaling of electronics,–. Minimizing the dimensions of …

Advances in science, medicine and engineering rely on breakthroughs in imaging,
particularly for obtaining multiscale, three-dimensional information from functional systems …

Polyhedral oligomeric silsesquioxanes (POSS) are of considerable interest as building
blocks for preparing low‐k materials. To date T8 POSS has been extensively investigated …

Mesoporous organic–inorganic hybrid materials, a new class of materials characterized by
large specific surface areas and pore sizes between 2 and 15 nm, have been obtained …

Metal–organic frameworks (MOFs) with low density, high porosity, and easy tunability of
functionality and structural properties, represent potential candidates for use as …

The progressively decreasing feature size of the circuit components has tremendously
increased the need for the global surface planarization of the various thin film layers that …

Due to their high service temperature, excellent thermal insulation, nanoporous morphology,
and low dielectric constant, polyimide (PI) aerogels have the potential capability to be used …

Polyimides are ideal candidates for 5G high-frequency communications due to their good
thermal stability, mechanical properties and processability. However, the exploration of how …