Thermal management is critical to the performance, lifetime, and reliability of electronic
devices. With the miniaturization, integration and functionalization of electronics and the …

Thermal conduction in polymeric materials and across interfaces is of considerable scientific
and technological importance nevertheless only very few studies are available without …

Electronic devices play a vital role in our lives and are expected to play an even bigger role
in the future considering their immense contribution in every field. Current trends are drifting …

With the fast-developing miniaturization and integration of microelectronics packaging
materials, ultrahigh-voltage electrical devices, light-emitting diodes (LEDs), and in areas …

Personal thermal management, including warming, cooling, and adaptive thermoregulation
of human body, is critical to the comfort and performance of individuals in daily life. Most …

Pultruded glass fibre reinforced polymer (GFRP) profiles are finding increasing applications
in civil engineering structures, owing to the several advantages they offer over traditional …

Heat conduction in multi-layer and composite materials is one of the fundamental heat
transfer problems in many industrial applications. Due to different materials types, interface …

Efficient thermal interface materials (TIMs) are urgently needed for heat dissipation of high-
power density electronics. In this study, vinyl polydimethylsiloxane (PDMS) composites with …

A decomposition model for resin in glass fiber-reinforced polymer composites (GFRP) under
elevated and high temperature was derived from chemical kinetics. Kinetic parameters were …

In this paper the thermal conductivity of epoxy-based composite materials is analysed. Two-
and three-phase Lewis–Nielsen models are proposed for fitting the experimental values of …