Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model
A numerical method for studying migration of voids driven by pulse electric current and
thermal gradient in 95.5 Sn–4Ag–0.5 Cu (SAC405) solder joints is developed. The …
thermal gradient in 95.5 Sn–4Ag–0.5 Cu (SAC405) solder joints is developed. The …
Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study
Electromigration and thermomigration reliability of Sn96. 5% Ag3. 0% Cu0. 5 (SAC305 by
weight) solder joints under alternating current is studied experimentally with the maximum …
weight) solder joints under alternating current is studied experimentally with the maximum …
Electromigration in lead-free solder joints under high-frequency pulse current: An experimental study
The insatiable demand for miniaturization of consumer electronics has brought continuing
challenges in the electronic packaging field. As a consequence, immense information …
challenges in the electronic packaging field. As a consequence, immense information …
[图书][B] Damage mechanics of Electromigration and Thermomigration in electronics packaging solder joints under time varying current loading
W Yao - 2013 - search.proquest.com
The insatiable demand for miniaturization of consumer electronics has brought continuing
challenges in the electronic packaging field. As a consequence, immense information …
challenges in the electronic packaging field. As a consequence, immense information …