High‐temperature resistance and excellent electrical insulation in epoxy resin blends

C Zhang, Z Liu, T Zhang, X Wang, C Yin… - Journal of Applied …, 2023 - Wiley Online Library
The packaging insulation material was a crucial component to guarantee the stable and safe
operation of electronic devices. Epoxy resin, one of the most popular packaging materials …

Preparation of a Crosslinked Poly (imide-siloxane) for Application to Transistor Insulation

HJ Park, JY Choi, SW Jin, SH Lee, YJ Choi, DB Kim… - Polymers, 2022 - mdpi.com
Insulated gate bipolar transistor (IGBT) is an important power device for the conversion,
control, and transmission of semiconductor power, and is used in various industrial fields …

[PDF][PDF] Sustainability of high temperature polymeric materials for electronic packaging applications

O Adekomaya, T Jamiru, ER Sadiku… - Applied Science and …, 2018 - researchgate.net
Abstract Development of polymeric packaging materials for electronic devices have attracted
discussions in many published works amid challenges in high speed electronic …

Improvement in volume resistivity and morphology of a blend of polyolefin elastomer with linear low-density polyethylene

M Dana, GH Zohuri, S Asadi - Iranian Polymer Journal, 2019 - Springer
A silane moisture-cured polyolefin elastomer/linear low-density polyethylene (LLDPE) blend
was prepared through a two-step silane-grafting method (Sioplas Process) in an industrial …

[PDF][PDF] Mehri Dana, Gholam Hossein Zohuri &

S Asadi - Iran Polym J, 2019 - researchgate.net
A silane moisture-cured polyolefin elastomer/linear low-density polyethylene (LLDPE) blend
was prepared through a two-step silane-grafting method (Sioplas Process) in an industrial …

[引用][C] Caracterização físico química e otimização de formulações de poliuretano para a indústria elétrica.

JWC Palma - 2017 - IFQ-Instituto de Física e Química