Abstracts A lead-free Ag-based soldering technique through transient-liquid-phase (TLP)
bonding is proposed in this study for high-temperature microelectronic packaging …

Ceramics joining has been widely applied in MEMS sensors, microwave and imaging
devices as well as other ceramic packaging applications to fabricate multifunctional ceramic …

Abstract The Bi 2 O 3–B 2 O 3–SiO 2 glass solder was used to join the Li–Ti ferrite. SEM
micrographs of the joints showed the formation of FeBi 5 Ti 3 O 15 whiskers at the interface …

This study investigates the ceramic to ceramic bonding, using composite glass frit as the
binding layer that is able to tolerate a high temperature environment for ruggedized …

Zn based lead free solder for high temperature applications was developed by the addition
of Ni. The effect of Ni content on the characteristics of the solder such as change in …

This article presents the development of a laser-assisted sintering method of a silver
nanoparticle paste for bonding of a silicon chip to a direct bonded copper (DBC) substrate …

The performance of Pb-free SAC305 solder joint added with porous Cu interlayer was
investigated. The porous Cu interlayer was placed in a sandwich-like layer between …

Replacing the lead (Pb)-containing solders with the Pb-free solders in electronic products
has been a global trend due to environmental and human health concerns for the toxicity of …

The effects of nickel additions on the change in microstructure of Zn-xNi lead free solder
alloys were investigated. The investigation revealed that increasing Ni additions led to the …

Coexistence of a high-temperature, corrosive medium and mechanical stressing during
device applications requires a novel form of technology in package assembly level to join …