Electrochemical migration (ECM) is one of the serious failure modes encountered in
electronic devices due to the electrochemical reactions triggered by the presence of …

This article reviews corrosion in electronic packaging mainly in the semiconductor industry
over the world. The previous study was reviewed scientifically to highlight the significant …

Printed circuit board (PCB) based biosensors have often utilized hard gold electroplating,
that nullifies the cost advantages of this technology as compared to screen printed …

We studied the diffusion bonding mechanism and interfacial reactions between sintered
nanosilver and direct-bond-copper substrates with different surface finishes, ie, electroless …

The metallization process has received significant attention in the electronic industry. It is
one of the best method to enhance bonding strength via interfacial reaction between the …

Electroless Ni (P)/electroless Pd/immersion Au (ENEPIG) is a common surface finish in
electronic packaging, while the Ni (P) layer increases the impedance of solder joints and …

An immersion gold-plating process on electroless Ni–P alloy substrate was investigated.
The immersion Au coating was deposited from a thiosulfate–sulfite mixed ligand bath based …

In this work, the corrosion behavior of printed circuit board finished with electroless nickel
immersion gold (PCB-ENIG) in a simulated marine atmospheric environment with industrial …

Failure of electronic components of printed circuit boards (PCBs) is a major concern,
especially during storage. In the present study, we analyzed different modes of damages …

The growth of intermetallic compounds (IMCs) of HASL/SN97C (Sn-3.0 Ag-0.5 Cu) and
HASL/SN100C (Sn-0.7 Cu-0.05 Ni-0.007 Ge) during reflow soldering and isothermal ageing …