A survey of phase classification techniques for characterizing variable application behavior

K Criswell, T Adegbija - IEEE Transactions on Parallel and …, 2019 - ieeexplore.ieee.org
Adaptable computing is an increasingly important paradigm that specializes system
resources to variable application requirements, environmental conditions, or user …

Implementation of the big data management system for demand side energy management

J Choi, M Kim, J Yoon - 2015 IEEE International Conference on …, 2015 - ieeexplore.ieee.org
In this work, we develop the Business Platform for demand side management in energy
sector. This paper introduces the Business Platform and describes the development of the …

Manufacturer turned attacker: Dangers of stealthy trojans via threshold voltage manipulation

VC Patil, A Vijayakumar, S Kundu - 2017 IEEE North Atlantic …, 2017 - ieeexplore.ieee.org
Applications of Integrated Circuits (ICs) have become pervasive. A striking feature of the
contemporary IC industry is that a very large and growing proportion of the IC foundries are …

Modeling residual lifetime of an ic considering spatial and inter-temporal temperature variations

MN Islam, S Kundu - 2016 IEEE 25th Asian Test Symposium …, 2016 - ieeexplore.ieee.org
In today's CMOS technology, reliability of integrated circuits is a significant concern. Higher
temperatures during circuit operation accelerates the device aging. Power dissipation in an …

Thermal-aware SoC test scheduling with voltage/frequency scaling and test partition

Y Zhang, L Ling, J Jiang, J Xiao - Journal of Electronic Testing, 2018 - Springer
With increasing power density in modern integrated circuits, thermal issues are becoming a
critical problem in System-on-a-Chip (SoC) testing. In this paper, we develop the thermal …

Processor Temperature And Reliability Estimation Using Activity Counters

M Chhablani - 2016 - scholarworks.umass.edu
With the advent of technology scaling lifetime reliability is an emerging threat in high-
performance and deadline-critical systems. High on-chip thermal gradients accelerates …

A novel PoP model with thermal reliability

XQ Lai, DL Zhou, LF Shi, HX Du… - 2013 IEEE International …, 2013 - ieeexplore.ieee.org
As increasing harsher requirements are brought in to meet the specification for the volume
and the area, the integration level of systems tends to be denser and then a high density …