This paper reviews CMOS (complementary metal-oxide-semiconductor) MEMS (micro-
electro-mechanical systems) fabrication technologies and enabled micro devices of various …

This review critically summarizes the recent advances of the microcantilever-based force
sensors for atomic force microscope (AFM) applications. They are one the most common …

A microstacked PZT actuator of dimensions 8 mm× 0.8 mm× 0.4 mm and capable of 2.3-μm
actuation under a voltage of 100 V was fabricated and characterized. This actuator was then …

This paper presents an attractive poly-SiGe thin-film packaging and MEM (
microelectromechanical) platform technology for the generic integration of various packaged …

We have demonstrated a MEMS memory device utilizing an array of cantilevered AFM probe
tips fabricated directly on standard CMOS, and integrated with a ferroelectric media on a …

We present an attractive poly-SiGe thin film packaging and MEM (Micro Electro-Mechanical)
platform technology for integrating various packaged MEM devices above standard CMOS …

Capacitive micromachined ultrasound transducers (CMUT) have the potential to enable 3-D
ultrasound imaging. This paper reports a novel manufacturable buildup of a CMUT device …

In this paper, the physical loss mechanisms in boron doped poly-SiGe are analyzed
theoretically and experimentally. The phonon losses were calculated theoretically for …

Probe-based data storage attracted many researchers from academia and industry, resulting
in unprecendeted high data-density demonstrations. This topical review gives a …

MEMS above-IC monolithic integration can yield a very compact device with good cost-
effectiveness. One of the major challenges for this technology is to protect the CMOS from …