Heat and fluid flow in high-power LED packaging and applications
Light-emitting diodes (LEDs) are widely used in our daily lives. Both light and heat are
generated from LED chips and then transmitted or conducted through multiple packaging …
generated from LED chips and then transmitted or conducted through multiple packaging …
Die attachment, wire bonding, and encapsulation process in LED packaging: A review
Light-emitting diodes (LEDs) are considered an ideal substitute for low-efficiency traditional
light sources with broad applications in all scientific disciplines. For the past recent years …
light sources with broad applications in all scientific disciplines. For the past recent years …
Application of micro/nano technology for thermal management of high power LED packaging–A review
M Hamidnia, Y Luo, XD Wang - Applied Thermal Engineering, 2018 - Elsevier
With technological progress, the request for high power LEDs (HP-LEDs) as a replacement
candidate for common lamp is increased. Due to dissipation of 70–85% of LED input power …
candidate for common lamp is increased. Due to dissipation of 70–85% of LED input power …
A review of direct drive proportional electrohydraulic spool valves: industrial state-of-the-art and research advancements
P Tamburrano, AR Plummer… - Journal of …, 2019 - asmedigitalcollection.asme.org
This paper reviews the state of the art of directly driven proportional directional hydraulic
spool valves, which are widely used hydraulic components in the industrial and …
spool valves, which are widely used hydraulic components in the industrial and …
Thermal management and characterization of high-power wide-bandgap semiconductor electronic and photonic devices in automotive applications
GaN-based high-power wide-bandgap semiconductor electronics and photonics have been
considered as promising candidates to replace conventional devices for automotive …
considered as promising candidates to replace conventional devices for automotive …
Experimental and multiphysics simulation study of atoms migration and morphology evolution in solder joints under high current density
F Jia, L Niu, Y Xi, Y Qiu, H Ma, C Yang - … Journal of Heat and Mass Transfer, 2023 - Elsevier
Voids in solder joints induced by electromigration significantly affect the mechanical and
electrical properties of materials, causing performance degradation and reduction in …
electrical properties of materials, causing performance degradation and reduction in …
A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials
MI Okereke, Y Ling - Applied Thermal Engineering, 2018 - Elsevier
Process-induced solder voids have three-dimensional shapes and show spatially random
distribution with polydisperse geometric dimensions. There exists no analytical formulation …
distribution with polydisperse geometric dimensions. There exists no analytical formulation …
Comparison of nondestructive testing methods for solder, sinter, and adhesive interconnects in power and opto-electronics
M Schmid, SK Bhogaraju, E Liu, G Elger - Applied Sciences, 2020 - mdpi.com
Reliability is one of the major requirements for power and opto-electronic devices across all
segments. High operation temperature and/or high thermomechanical stress cause defects …
segments. High operation temperature and/or high thermomechanical stress cause defects …
Deep machine learning of the spectral power distribution of the LED system with multiple degradation mechanisms
The performance and reliability of the light-emitting diode (LED) system significantly depend
on the thermal–mechanical loading-enhanced multiple degradation mechanisms and their …
on the thermal–mechanical loading-enhanced multiple degradation mechanisms and their …
The improvement of bonding metal layers for high resolution micro-LED display application
X Ji, K Wang, H Zhou, F Wang, L Yin… - Applied Physics Letters, 2023 - pubs.aip.org
In this article, a resolution of 15× 30 blue flip-chip micro-LED array with a pixel size of 20× 35
μm 2 was fabricated. The micro-LED array was hybridized with the silicon backplane via flip …
μm 2 was fabricated. The micro-LED array was hybridized with the silicon backplane via flip …