LIBRA: Thermal and process variation aware reliability management in photonic networks-on-chip
IG Thakkar, S Pasricha - IEEE Transactions on Multi-Scale …, 2018 - ieeexplore.ieee.org
Silicon nanophotonics technology is being considered for future networks-on-chip (NoCs) as
it can enable high bandwidth density and lower latency with traversal of data at the speed of …
it can enable high bandwidth density and lower latency with traversal of data at the speed of …
Greencool: An energy-efficient liquid cooling design technique for 3-d mpsocs via channel width modulation
Liquid cooling using interlayer microchannels has appeared as a viable and scalable
packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel …
packaging technology for 3-D multiprocessor system-on-chips (MPSoCs). Microchannel …
Optimized micro-channel design for stacked 3-D-ICs
B Shi, A Srivastava - … on Computer-Aided Design of Integrated …, 2013 - ieeexplore.ieee.org
The three dimensional circuit (3-D-IC) achieves high performance by stacking several layers
of active electronic components vertically. Despite its impact on performance improvement, 3 …
of active electronic components vertically. Despite its impact on performance improvement, 3 …
Clustering throughput optimization on the gpu
M Gowanlock, CM Rude, DM Blair, JD Li… - 2017 IEEE …, 2017 - ieeexplore.ieee.org
Large datasets in astronomy and geoscience often require clustering and visualizations of
phenomena at different densities and scales in order to generate scientific insight. We …
phenomena at different densities and scales in order to generate scientific insight. We …
STEAM: A fast compact thermal model for two-phase cooling of integrated circuits
Two-phase liquid cooling of computer chips via microchannels etched directly on silicon
dies is a potential long-term solution to enable continued integration of high-performance …
dies is a potential long-term solution to enable continued integration of high-performance …
Optimization of the Solid-State Copper Brazing Condition Using Desirability Function and Genetic Algorithm
This research studies on optimization of solid-state copper brazing condition and
comparatively investigates the ability of the desirability function and genetic algorithm (GA) …
comparatively investigates the ability of the desirability function and genetic algorithm (GA) …
Accurate models for optimizing tapered microchannel heat sinks in 3D ICs
High-performance computing systems, especially 3D ICs, are yet facing thermal
exacerbation. Inter-tier liquid cooling microchannel layers have been introduced into 3D ICs …
exacerbation. Inter-tier liquid cooling microchannel layers have been introduced into 3D ICs …
Simulation and experimental study of flexible cooling system based on microchannel in PDMS
In this article, a flexible cooling method based on microchannels in polydimethylsiloxane
(PDMS) substrate is proposed, for those flexible and conformal circuits or systems. The …
(PDMS) substrate is proposed, for those flexible and conformal circuits or systems. The …
Power-thermal modeling and control of energy-efficient servers and datacenters
Power-Thermal Modeling and Control of Energy-Efficient Servers and Datacenters |
SpringerLink Skip to main content Advertisement SpringerLink Account Menu Find a journal …
SpringerLink Skip to main content Advertisement SpringerLink Account Menu Find a journal …
A semi-analytical thermal modeling framework for liquid-cooled ICs
With the development of liquid-cooled integrated circuits (ICs) using silicon microchannels,
the study of heat transfer and thermal modeling in liquid-cooled heat sinks has gained …
the study of heat transfer and thermal modeling in liquid-cooled heat sinks has gained …