Achieving of intensified conductive interconnections for Flex-on-Flex by using metal passivated...

Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification with Ti/Cu/Ti/TiO2 Thin Films

Z Fang, J Zhang, Y Guo, L Gao, H Chen… - IEEE Transactions …, 2023 - ieeexplore.ieee.org
There are many applications for glass-to-glass bonding, such as manufacturing optical
devices, electronic components, and microsystem applications. This article presents a …
被引用次数：3 相关文章

Exploration and Analysis of Through-Glass Vias for High-Speed, Low-Loss Vertical Interconnects in Glass-Based 3-D Integrated Circuits

Z Fang, J Zhang, J Liu, J Fu, S Li, X Cai… - … on Electron Devices, 2024 - ieeexplore.ieee.org
In glass-based 3-D integrated circuits (ICs), nonuniform through-glass vias (TGVs) contribute
to increased delay, higher losses, and performance degradation, particularly notable in …
被引用次数：1 相关文章

Interface Analysis of High Reliable Hermitic Sealed Microfluidic Channels for Thermal Cooling in 3D ICs

HK Cheemalamarri, S Bonam, D Banik… - 2019 IEEE 21st …, 2019 - ieeexplore.ieee.org
Thermal management is the critical issue in all present conventional 2D electronic
packages, and is more crucial in the case staked dies of advanced 3D IC technology …
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High Density metal alloy Interconnections Using Novel Wafer Bonding Approach For 3D IC Packaging Applications

CH Kumar, S Bonam, SRK Vanjari… - 2018 IEEE 20th …, 2018 - ieeexplore.ieee.org
The solder is the one of the most interconnect joining material in the denser electronic
interconnects. To follow the paradigm, shift towards the Moor's law, an advanced electronic …
被引用次数：1 相关文章