In a flip chip package, due to the sharp square chip corner geometry and the loading from
mismatches in the coefficients of thermal expansion between materials in the assembly, a …

Purpose This paper aims to present new analytical model for the filling times prediction in
flip-chip underfill encapsulation process that is based on the surface energetic for post-bump …

Underfill (UF) is an important material in advanced packaging and widely used for flip chip
interconnection to improve reliability of the encapsulation. In flip-chip package, how UF …

Since the finite element analysis (FEA) has been widely used in material design and
reliability assessment of electronic packaging, whether FEA captures the characteristics of …

Afin de protéger les interconnexions dans les assemblages, une couche de matériau
d'underfill est utilisée pour remplir le volume et fournir un support mécanique entre la puce …