Continuous demands to develop advanced radio-frequency transmission at higher
frequencies have initiated glass-based materials as a substrate in radio-frequency micro …

The evolution of electronic packaging technology towards the adoption of glass substrates
marks a significant advancement in overcoming the constraints posed by traditional organic …

3D integration consists of 3D IC packaging, 3D IC integration, and 3D Si integration. They
are different and in general the TSV (through-silicon via) separates 3D IC packaging from …

A double-sided and ultrathin 3-D glass interposer with through package vias (TPVs) at same
pitch as through silicon vias (TSVs) in silicon interposers is developed to provide a …

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit
Boards and Packaging presents the electromagnetic modelling and design of three major …

Fabrication and characterization of electrodeposited copper filled through-glass vias (TGV)
are demonstrated on full-scale fused silica wafer for the first time by a simple combination of …

To use glass as the substrate material in next-generation large-scale integrations and
biochips, the high-speed fabrication of high-aspect-ratio microholes is necessary. Transient …

This study explored Through Glass Via (TGV) Formation Technology by using Focused
Electrical Discharging Method for alkali-fee glass which has well matched CTE with Si. 2.5 …

摘要人工智能和大数据时代对数据存储, 传输和处理能力的需求日益增加, 数据传输所需带宽和
通信速率也随之增加. 然而系统级封装中的电互连受到介质材料, 传输速率的影响 …

With the increasing demand for high-density integration, low power consumption and high
bandwidth, creating more sophisticated interconnection technologies is becoming …