Pb-based solders have been the cornerstone technology of electronic interconnections for
many decades. However, with legislation in the European Union and elsewhere having …

Due to its commercial potential and the technological challenges associated with
processing, low temperature soldering is a topic gaining widespread interest in both industry …

In this work, we applied a Ag flake formed paste for sinter-joining on bare Si, SiC, and GaN
surfaces. The sintered joints possess a high shear strength of over 40 MPa under a …

In the present study, varying weight percentages of carbon nanotubes (CNTs) were
incorporated into Sn–Ag–Cu solder matrix, to form composite solders. Isothermal aging …

Sn–Zn eutectic alloy has been considered as one of the lead-free solder materials that can
replace the toxic Sn–37Pb solder without increasing soldering temperature. This study …

Sn-Zn system solder has been considered promising lead-free solder materials to replace
Sn-Pb and Sn-Ag-Cu systems in various conditions, due to the performance characteristics …

Abstract Cu-Sn-Zn coatings have been widely used in industry for their unique properties,
such as good conductivity, high corrosion resistance and excellent solderability. To further …

The oxidation behavior of Sn–9Zn and Sn–8Zn–xBi (x= 1, 3, 6) solders under high-
temperature and high-humidity conditions has been investigated as a function of exposure …

In the present study, the effects of separate and dual addition of small amount of Ag and Cu
on the microstructure and mechanical properties of the eutectic Sn–9Zn solder alloy were …

Sn-Zn solders have been considered as promising lead-free solders. This study investigated
the shear strength and fracture mechanism of Sn-9Zn-2.5 Bi-1.5 In and Sn-3.0 Ag-0.5 Cu …