Progress of research on the bonding-strength improvement of two-layer adhesive-free flexible copper-clad laminates

W Tang, Y Liu, X Jing, J Hou, Q Zhang, C Jian - RSC advances, 2024 - pubs.rsc.org
The arrival of the 5G era has placed high demands on the electronic products. Developing
thin, light, and portable electronic products capable of simultaneously improving the …

Recent Progress in Modification of Polyphenylene Oxide for Application in High-Frequency Communication

L Liao, W Ruan, M Zhang, M Lin - Materials, 2024 - mdpi.com
With the rapid development of highly integrated electronic devices and high-frequency
microwave communication technology, the parasitic resistance–capacitance (RC) delay and …

Enhanced flame retardant and dielectric properties of oligo (2, 6-dimethyl-1, 4-phenylene ether) resins through DOPO derivative incorporation

YC Chen, JB Yang, SKR Kamani, MW Wang, JM Jehng… - Polymer, 2024 - Elsevier
Owing to their low-dissipation factor, oligo (2, 6-dimethyl-1, 4-phenylene ether)(OPE) resins
are commonly used to prepare copper-clad laminates (CCL) for high-frequency …

[HTML][HTML] Curing kinetics study of thermosetting resin material with ultra-low dielectric loss for advanced electronic packaging

Z Fang, X Wu, X Zhu, C Luo, D Li, Q Liu, K Wang - Polymer Testing, 2024 - Elsevier
Ultra-low-loss resin materials are widely utilized in the novel electronic packaging. In this
study, we have investigated the curing reaction kinetics of ultra-low-loss thermosetting resin …

トリフェニルホスフィンスルフィド部位を有する芳香族ポリチオエーテルの合成と誘電特性

一二三遼祐, 冨田育義 - ネットワークポリマー論文集, 2024 - jstage.jst.go.jp
抄録 低遅延・低損失な通信・信号処理を実現するための要素技術として, 低誘電絶縁材料に高い
関心が集まっている. 本研究では, トリフェニルホスフィンスルフィド部位を有する芳香族ポリ …