Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used
extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi …

Abstract Replacing Pb-Sn with Pb-free solders is one of the most important issues in the
electronic industry. Melting, dissolution, solidification and interfacial reactions are …

The effect of Ag nanoparticle size on the microstructure of solder matrix, microhardness,
growth of solder/Cu interfacial intermetallic compounds (IMC) and shear strength were …

The formation and growth of intermetallic compound (IMC) layer at the interface between Sn–
3.5 Ag lead-free solder and the Cu substrate during soldering and aging were studied. The …

Sn–Bi solders may be applied for electronic applications where low-temperature soldering is
required, ie, sensitive components, step soldering and soldering LEDs. In spite of their …

Intermetallic compound (IMC) formations of Sn–2.8 Ag–0.5 Cu solder with additional 1wt%
Bi were studied for Cu-substrate during soldering at 255° C and isothermal aging at 150° C …

The interfacial reactions and the growth behavior of interfacial intermetallic compounds
(IMCs), as well as their effects on the mechanical properties of the Sn-3.0 Ag-0.5 Cu …

The effects of multiple reflows (1, 2, 4, 6, 8, 10 numbers of reflow) on interfacial reaction and
shear strength of Sn3. 8Ag0. 7Cu (SAC) and Sn37Pb (SP) joints were systematically …

The Sn‐Bi base lead‐free solders are proposed as one of the most popular alloys due to the
low melting temperature (eutectic point: 139° C) and low cost. However, they are not widely …

The surface morphology, electrical property and reaction with solder alloy of two electroless
nickel-phosphorus (EN–P) deposits (Ni–7wt.% P and Ni–10wt.% P) were investigated in this …